PLANAR METAL
AND ITO ELECTRODEST(PMES
AND PITOES) |
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PLANAR ELECTRODE PRODUCTS |
Critical Dimensions |
Designs |
Conductor |
PMEMA1x3AU Microarray BioChip Substrate |
1.0”
x 3.0” x 0.04” |
Package of 5 |
BSGlass | 100Á Ti/W | 1,000Á Au |
PMEMA1x3PT Microarray BioChip Substrate |
1.0”
x 3.0” x 0.04” |
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BSGlass | 100Á Ti/W | 1,000Á Pt |
PME Au 118 |
1.0 cm x 2.0 cm x 0.05 cm |
Package of 6 |
BSGlass | 100Á Ti/W | 1,000Á Au |
PME Au 118-P (packaged chip) |
1.0 cm x 1.0 cm x 0.05 cm |
1 each |
BSGlass | 100Á Ti/W | 1,000Á Au |
PME Au 218 |
2.0 cm x 2.0 cm x 0.05 cm |
Package of 4 |
BSGlass | 100Á Ti/W | 1,000Á Au |
PME Pt 118 |
1.0 cm x 2.0 cm x 0.05 cm |
Package of 6 |
BSGlass | 100Á Ti/W | 1,000Á Pt |
PME Pt 118-P (packaged chip) |
1.0 cm x 1.0 cm x 0.05 cm |
1 each |
BSGlass | 100Á Ti/W | 1,000Á Pt |
PME Pt 218 |
2.0 cm x 2.0 cm x 0.05 cm |
Package of 4 |
BSGlass | 100Á Ti/W | 1,000Á Pt |
PITOE 118 |
1.0 cm x 2.0 cm x 0.05 cm |
Package of 6 |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PITOE 118-P (packaged chip) |
1.0 cm x 1.0 cm x 0.05 cm |
1 each |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PITOE 218 |
2.0 cm x 2.0 cm x 0.05 cm |
Package of 4 |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PITOE 150 |
0.9 cm x 5.0 cm x 0.05 cm |
Package of 6 |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PITOE 150-P (packaged chip) |
0.9 cm x 5.0 cm x 0.05 cm |
1 each |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PITOE 250 |
2.0 cm x 5.0 cm x 0.05 cm |
Package of 4 |
BSGlass | 1,000Á ITO (10 Ohms/p) |
PE CUSTOM |
YOUR DIMENSIONS |
YOUR QUANTITY |
YOUR SUBSTRATE |
Introduction and BackgroundØ Planar Metal Electrodes (PMEs) are highly uniform thin films of noble metals formed by magnetron sputter deposition or thermal evaporation onto planar insulating glass substrate plates. The conducting layer of gold or platinum (Pt or Au = 1,000 Á) is deposited following deposition of an adhesion promoting layer of titanium-tungsten (Ti/W = 100Á) that serves as the adhesion promoting layer. These layers are deposited onto a very smooth (60/40 scratch and dig finish), highly insulating, chemically resistant and non-leaching, electronics grade borosilicate glass substrate. Substrates such as silicon, with a thermally grown oxide or silicon nitride insulating layer, are also available. Ø PMEs and PITOEs have plate dimensions of 1.0 cm (w) x 2.0 cm (l) x 0.05 cm (t) (PME 118, PITOE 118) or dimensions of 2.0 cm x 2.0 cm x 0.05 cm (PME 218, PITOE 218). The PME 118 and PITOE 118 are also available as packaged electrodes wherein the chip is mounted onto the WAND CHIP CARRIER and encapsulated with an epoxy resin to reveal an approximately 1.0 cm x 1.0 cm active area. Ø PMEs and PITOEs may also be supplied in your custom dimensions to meet your uniques research and product development needs. Consult your applications development professional. Ø PMEs and PITOEs may also be supplied with your custom surface chemistries to meet your uniques research and product development needs. Consult your applications development professional. Back to top Applications of PMES and PITOESØ Electropolymerization of electroactive polymers: Ø Reflectance Spectroscopy of ultra thin polymer films and self assembled nano-layers. Ø Surface modification and derivatization: Ø Monolayer self assembly of alkane thiol SAMs, Langmuir-Blodgett films, adsorbed protein layers and polyelectrolyte LBL deposition. Ø Electrodes in electrochemistry. Back to top |
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Ø Chip Substrate: |
Schott D263 Borosilicate Glass |
Value |
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Dielectric Constant, Epsilon(r) at 1 MHz |
6.7 |
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Dielectric Loss Angle, tan delta, at 1 MHz |
61 x 10-4 |
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Electrical Resistivity (50 Hz) (250 C) |
1.6 x 108 ohm cm |
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Coefficient of Linear Thermal Expansion, * 20-300 Deg C |
7.2 x 10^-6 K^-1 |
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Refractive Index at 20 C, ne ( Lambda = 546.1 nm) |
1.5249 |
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Ø Metallization: |
100 Å Ti|W / 1000 Å Au or Pt and ITO = 10 Ohms/sq |
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Ø IME Chip Dimensions |
Un-packaged Die |
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(l x w x t) |
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PME 118 and PITOE 118 |
1.00 x 2.00 x 0.05 cm |
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PME 218 and PITOE 218 |
2.00 x 2.00 x 0.05 cm |
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Ø Mounting |
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IME WAND CHIP CARRIER OF PCB |
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Back to t*op |
PME and PITOE Accessories
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Dimensions |
D
= 9 mm |
11.4 cm |
N/A |
Connector Type |
Micropipette |
Gold Plated Pins to PCB |
Gold Plated Pins |
Number of Conductors |
2 each chamber: IN & OUT |
4 on PCB |
4 on one side |
Lead |
N.A. |
N.A. |
N.A. |
Part No. |
PC8R-0.5 |
WAND |
STC 4 |
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MethodsØ Cleaning: Chips may be cleaned using any of the standard methods developed for microfabricated devices and chips. General advice on cleaning is provided at ABTECH's “Download Files” web page. Ø Coating: Films or coatings may be applied to the PME or PITOE devices by microcontact printing, dip coating, spin casting, spray painting, air-brushing, brush painting, by the Langmuir-Blodgett thin film deposition technique, by electropolymerization, and by molecular self assembly. Ø Electrical connection: Electrical connections to the PMEs and PITOEs are best made using the STC 4 Test Clip. Alternatively, you may develop your own method of attachment of leadwires using a conductive epoxy (usually silver), low-temperature micro-soldering (indium) or simple alligator clip. For further information, request Application Notes or you may download application note files: Ø Because of the many possibilities for the use of PMEs and PITOEs, no application notes have yet been developed in support of this product line. PME and PITOE are tradenames for a family of devices developed by ABTECH Scientific, Inc. These devices are microfabricated (using microelectronics fabrication techniques) to form patterns of conductors deposited on an insulating substrate chip. They are designed for the simultaneous interrogation of the electrical, electrochemical, and optical properties of thin polymeric films and coatings, for applications in microelectrochemistry, and for electrical/electrochemical impedance spectroscopy. |
Last Revision 07/24/2005. © 2000-2005 ABTECH Scientific, Inc.
Contact:
Ann M. Wilson, Manager,
Applications Development ABTECH
Scientific, Inc.
800 East Leigh Street 52, Richmond, Virginia
23219
Telephone Number: +1-804-783-7829 Fax Number:
+1-804-783-7830
e-mail: sales@abtechsci.com